Ti-Alloy Dual Wave Soldering Machine JA-N350
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The Ti-Alloy Dual Wave Soldering Machine JA-N350 is a high-capacity, lead-free wave soldering machine for DIP assembly lines. Its titanium alloy solder pot resists tin adhesion and corrosion, while chip and smooth waves ensure complete hole fill. Part of our Wave Soldering Machine range.
Key Features
| Key Features | |
| Ti-Alloy Solder Pot: | Titanium alloy construction eliminates tin adhesion and corrosion, dramatically extending pot lifespan compared to standard cast iron or SS pots. |
| Dual Wave Soldering: | Chip wave (turbulent) + smooth wave configuration ensures complete solder penetration on complex through-hole and mixed-technology boards. |
| 3-Stage Hot Air Preheat: | Independent 3-zone preheating with total length of 1,600 mm; temperature uniformity within ±2°C for reliable flux activation and thermal stress reduction. |
| Stepper Motor Flux Spray: | Japanese scanning spray nozzle with rodless pneumatic cylinder and PLC control ensures even, precise flux application — reliable and consistent every cycle. |
| Ti-Alloy Conveyor Fingers: | Titanium alloy transport chain fingers with double V-groove, non-stick tin design; reinforced for long-term durability and clean solder quality. |
| PC + PLC Control System: | Dual control architecture (PC + PLC or Touchscreen + PLC options) with Win7 OS, bilingual Chinese/English interface, and black-box SPC data logging. |
| Lead-Free & Pb Solder Ready: | Supports both lead-free (SAC alloys) and traditional Sn-Pb soldering processes; independent furnace design for easy cleaning and process changeover. |
| Nitrogen Option Available: | Optional nitrogen atmosphere module with high-accuracy oxygen analyzer; nitrogen consumption ~16 m³/hr at 1,000 ppm for oxide-free, high-quality joints. |
| Auto Claw Cleaning: | Automatic conveyor claw washing system maintains claw cleanliness to prevent solder bridging and contamination defects. |
| Energy-Efficient Design: | Running power as low as 7 kW during production; frequency converter drive and intelligent board detection minimize power consumption and flux waste. |
Product Description
The JA-N350 is a high-capacity, lead-free dual wave soldering machine engineered for demanding DIP (Through-Hole) PCB assembly lines. Featuring a titanium-alloy solder pot and a robust 3-stage hot air preheating system, the N350 delivers consistent, high-quality solder joints across a wide range of PCB formats — from consumer electronics to automotive and industrial applications.
Designed for efficiency, energy savings, and environmental compliance, the N350 combines PLC-based automation with a user-friendly touchscreen interface, making it simple to operate while maintaining strict process control. Its continuous inline conveyor design ensures seamless integration into any SMT/DIP production line, supporting both lead-free and Sn-Pb soldering processes.
Technical Specifications
| Specification | Details |
| Model | JA-N350 |
| Machine Type | Dual Wave Soldering Machine (Chip Wave + Smooth Wave) |
| Input Voltage | 380V AC / 50~60Hz (3-phase) |
| Total Power | ≤ 20 kW |
| Running Power | ~7 kW (during production) |
| Solder Power | 380V / 12 kW |
| Preheat Power | 220V / 8 kW |
| Preheat Zones | 3 independent zones (hot air) |
| Preheat Length | 1,600 mm total |
| Preheat Temp. Uniformity | ±2°C |
| PCB Board Width | 50 ~ 350 mm (adjustable) |
| Conveyor Speed | 300 ~ 2,000 mm/min (adjustable) |
| Conveyor Direction | Left to Right (Right to Left optional) |
| Conveyor Angle | Adjustable (contact factory for range) |
| Solder Pot Material | Titanium Alloy |
| Solder Pot Capacity | ~280 kg (330 kg variant available) |
| Solder Pot Temperature | Up to 400°C |
| Solder Type | Lead-Free (SAC) / Sn-Pb |
| Solder Temp. Control | PID + SSR dual independent outer-heating |
| Wave Crest Drive | 220V / 1 kW imported high-frequency inverter motor |
| Flux System | Stepper motor scanning spray; Japanese nozzles + rodless pneumatic cylinder |
| Air Supply | 0.5 MPa |
| Machine Dimensions (Body) | 3,300 (L) × 1,420 (W) × 1,750 (H) mm |
| Machine Dimensions (Overall) | ~4,100 (L) × 1,420 (W) × 1,750 (H) mm |
| Machine Weight | ~1,300 kg |
| Control System | PC + PLC / Touchscreen + PLC (options available) |
| OS / Interface | Windows 7; Chinese & English bilingual |
| Solder Warm-up Time | ~120 min to reach 250°C |
| Preheat Warm-up Time | ~10–15 min to reach 150°C |
| Nitrogen Option | Available (O₂ analyzer; ~16 m³/hr at 1,000 ppm) |
| Certification | CE, ISO 9000, RoHS, CCC |
| Warranty | 1 Year |
| Place of Origin | Shenzhen, Guangdong, China |
| * Specifications may vary. Please contact JIT or your authorized distributor for the latest confirmed datasheet. | |
Applications
The JA-N350 is suited for high-volume, high-reliability through-hole and mixed-technology soldering processes including:
- Through-hole component soldering in high-volume DIP assembly lines
- Mixed-technology PCB assembly (SMT + DIP) production
- Automotive ECU, power module, and sensor PCB soldering
- Industrial control boards, relay modules, and connector-heavy assemblies
- LED driver boards and power supply PCB production
- Telecommunications and networking equipment PCB manufacturing
- Medical device PCB assemblies requiring precise temperature control
- Aerospace and defense high-reliability through-hole soldering
Industries Served
- Consumer electronics and smart device manufacturing
- Automotive electronics (ECUs, ADAS modules, LED lighting, EV battery systems)
- Aerospace & defense high-reliability PCB assemblies
- Medical devices and life sciences electronics
- Industrial automation, power electronics, and control systems
- Telecommunications, networking, and 5G infrastructure
- LED lighting and display panel production
Why Choose the N350?
| vs. N300 / N250 (Smaller Models) | vs. Standard Cast Iron / SS Solder Pot |
| Larger PCB width capacity (350 mm), longer preheat zone (1,600 mm), higher solder pot volume — ideal for bigger boards and higher throughput. | Titanium alloy pot resists tin corrosion and adhesion — significantly longer pot lifespan, lower maintenance cost, and cleaner solder joints. |
| vs. Single Wave Machines | vs. Selective Soldering |
| Dual wave (chip + smooth) ensures full solder coverage on complex through-hole boards including connectors and mixed-tech assemblies. | Full-board wave soldering is dramatically faster for high-volume DIP production; selective soldering suits low-volume mixed-technology boards. |
