Manual Mini Wave Soldering Machine JA-N200
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The Manual Mini Wave Soldering Machine JA-N200 is a compact, cost-effective solution for DIP boards and prototypes. Automatic conveying, PLC-controlled flux spraying and infrared preheating fit in a small footprint. Part of our Wave Soldering Machine range in Soldering Solutions.
Key Features
| Key Feature | Description |
| Automatic Conveying Power System | Fully automated conveying with auto synchronous board feeding functions, ensuring smooth and consistent PCB flow through the machine without manual intervention. |
| Japanese Scanning Spray Flux System | Transverse scanning spray nozzle system using premium Japanese nozzles with rodless pneumatic cylinder and PLC control — delivering precise, even flux application every cycle. |
| IR Ceramic Preheating (1 Zone) | Remote infrared ceramic heating pipe preheating system provides efficient, direct heat radiation to the PCB bottom — fast ramp-up to 150°C in ~10–15 minutes and thorough flux activation. |
| Frequency-Converter Wave Crest Drive | Solder pot peak uses imported high-frequency conversion motor with independent control and stepless frequency converter speed adjustment — precise, independent wave height control for consistent solder joints. |
| Titanium Alloy Solder Pot | Solder pot constructed from titanium alloy for superior resistance to tin corrosion and adhesion — extended pot lifespan, lower maintenance costs, and cleaner solder quality vs. standard cast iron. |
| Special Alloy Conveyor Fingers | Non-stick tin, reinforced double V-groove special alloy chain claw fingers ensure reliable PCB transport and clean solder joint quality with minimal contamination risk. |
| PID + SSR Temperature Control | PID closed-loop temperature control combined with SSR (Solid State Relay) driving for the solder pot — precise, stable temperature maintenance up to 300°C with ±1°C accuracy. |
| PLC Control System | PLC-based control with press-key operation as standard; optional touch screen or full PC control upgrade available for enhanced process parameter management and data traceability. |
| UPS & Fault Alarm System | Built-in fault diagnosis and audible/visual alarm system with automatic delay shutdown protection — prevents PCB and machine damage during abnormal conditions or power interruptions. |
| Lead-Free & Sn-Pb Compatible | Supports both lead-free (SAC alloy) and traditional Sn-Pb soldering processes with an independently designed, easy-to-clean solder furnace compliant with RoHS requirements. |
Product Description
The JA-N200 is a compact, cost-effective manual mini wave soldering machine engineered for DIP (Through-Hole) PCB assembly, prototype production, and AI PCB processing lines. Combining automatic conveying, PLC-controlled flux spraying, and infrared preheating in a space-saving footprint, the N200 delivers reliable, consistent solder joint quality for a wide range of small-to-medium production volumes.
Designed with simplicity and reliability in mind, the N200 features an independent titanium alloy solder pot, Japanese scanning spray nozzle flux system, and a PID+SSR temperature control system — all in a compact 2,100 × 1,200 mm overall footprint. It supports both lead-free (SAC) and Sn-Pb processes, making it a versatile entry-point machine for any PCB assembly operation requiring wave soldering capability.
Technical Specifications
| Specification | Details |
| Model | JA-N200 |
| Machine Type | Manual Mini Wave Soldering Machine (Lead-Free / Sn-Pb) |
| Condition | New |
| Warranty | 12 Months |
| Preheating Zones | 1 zone |
| Preheating Zone Length | 450 mm |
| Preheating Method | IR Infrared Ceramic (standard); Hot Air optional |
| Preheating Power | 220V / 5 kW |
| Preheating Time | ~10–15 min to reach 150°C |
| Temp. Setting Range | Room temperature to 300°C |
| Solder Type | Lead-Free (SAC) / Sn-Pb |
| Solder Pot Capacity | 180 kg |
| Solder Pot Material | Titanium Alloy |
| Solder Pot Temperature | Up to 300°C |
| Solder Power | 380V / 6 kW |
| Solder Temp. Control | PID + SSR dual control |
| Wave Crest Drive Power | 220V / 500 W |
| Solder Warm-up Time | ~120 min to reach 250°C |
| PCB Width | 50 – 250 mm |
| Conveyor Speed | 300 – 1,800 mm/min |
| Conveyor Direction | Left to Right (Right to Left optional) |
| Conveyor Angle | 4 – 7° |
| Component Lead Clearance | Within 10 mm |
| Flux System | Japanese scanning spray nozzle, rodless pneumatic cylinder, PLC controlled |
| Flux Pressure | 3 – 5 bar |
| Flux Tank Capacity | 3.2 L |
| Power Supply | 3-phase 380V / 50–60 Hz |
| Total Power | 9 kW |
| Running Power | 3 – 5 kW |
| Air Supply | 0.5 MPa |
| Control Method | Press Key + PLC (Touch Screen / PC optional) |
| Body Dimensions (L×W×H) | 1,400 × 1,200 × 1,600 mm |
| Overall Dimensions (L×W×H) | 2,100 × 1,200 × 1,600 mm |
| Machine Weight | 500 kg |
| Certification | CE, CCC, ISO 9000, RoHS |
| Place of Origin | Shenzhen, Guangdong, China |
Model Comparison: N200 vs. N250
| Parameter | N200 (This Model) | N250 (Upgraded) |
| PCB Width | 50 – 250 mm | 50 – 300 mm |
| Solder Pot Capacity | 180 kg | 220 kg |
| Preheating Zones | 1 zone / 450 mm | 2 zones / 800 mm |
| Overall Dimensions | 2,100 × 1,200 × 1,600 mm | 2,600 × 1,200 × 1,600 mm |
| Machine Weight | 500 kg | 700 kg |
| Best For | Compact lines, smaller PCBs, AI/prototype runs | Mid-volume DIP lines, wider boards |
Applications
- Through-hole (DIP) component soldering for small-to-medium volume PCB assembly lines
- AI PCB processing and prototype/R&D board soldering requiring compact, flexible equipment
- Manual and semi-automated PCB soldering in space-constrained production environments
- Consumer electronics: IoT modules, smart home devices, remote controls, LED driver boards
- Industrial control boards, sensor modules, relay assemblies, and power supply PCBs
- Automotive electronics: small ECU boards, sensor PCBs, and lighting module assemblies
- Telecommunications and networking equipment PCB through-hole soldering
- Educational, training, and low-volume contract manufacturing (EMS/PCBA services)
Industries Served
- Consumer electronics and smart device manufacturing
- Automotive electronics (sensors, ECUs, LED modules)
- Industrial automation and control system manufacturing
- AI hardware, IoT, and embedded systems prototyping
- Telecommunications and networking equipment
- Medical device PCB assembly (low-volume, high-reliability)
- Contract electronics manufacturing (EMS / PCBA services)
