Therm-a-gap CIP 60 Thermally Conductive Cure-In-Place Compound
Therm-a-gap CIP 60 Thermally Conductive Cure-In-Place Compound is a 2K thermal gap filler with 6.0 W/m-K conductivity, built for automated dispensing in high-volume production. It replaces thermal pads with better surface conformity and efficient heat dissipation. Part of our Parker range in Adhesives & Fluids.
Description
Therm-a-gap CIP 60 is a two-component (2K) cure-in-place thermal interface material designed for efficient heat dissipation in demanding electronic systems. With a thermal conductivity of 6.0 W/m-K, it transfers heat effectively from components to heat sinks while providing excellent surface conformity and mechanical stability.
Its dispensable formulation replaces traditional thermal pads, allowing better gap filling, improved design flexibility, and compatibility with automated manufacturing processes.
Key Features
- High thermal conductivity (6.0 W/m-K) for efficient heat transfer
- Two-component dispensable system with 1:1 mix ratio
- Conformable to complex geometries and uneven surfaces
- No pre-cut pads required, improving manufacturing efficiency
- Vibration damping to reduce mechanical stress
- Low outgassing for sensitive electronic environments
Technical Specifications
| Property | Value |
|---|---|
| Filler Material | Aluminum Oxide |
| Thermal Conductivity | 6.0 W/m-K |
| Hardness | 50 Shore 00 |
| Operating Temperature | -50°C to 200°C |
| Specific Gravity | 3.2 |
| Viscosity | 5000 P |
| Heat Capacity | 1 J/g-K |
| Volume Resistivity | 10¹³ ohm-cm |
| Dielectric Strength | 9.3 kVAC/mm |
| Dielectric Constant | 8 @ 1 MHz |
| Dissipation Factor | 0.006 @ 1 MHz |
| Flammability Rating | UL 94 V-0 |
| Outgassing (TML) | 0.05% |
| Shelf Life | 6 months |
Application & Curing
- Dispense using manual or automated systems with static mixer
- Cure conditions:
- 60 minutes @ 100°C
- 24 hours @ 25°C
Typical Applications
- Automotive electronics (inverters, ADAS, control modules)
- Energy storage systems and battery modules
- Power electronics and converters
- Telecommunications and data center equipment
Advantages
- Better gap filling and surface coverage than thermal pads
- Improved reliability with vibration resistance
- Simplified production without pad cutting or placement
- Suitable for high-volume automated manufacturing
Therm-a-gap CIP 60 is a reliable solution for applications requiring high thermal conductivity, flexible processing, and long-term performance in modern electronics and power systems.
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