2K Silicone Adhesive (Temperature Curing)
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The 2K Silicone Adhesive (Temperature Curing) is a two-component silicone for potting and encapsulating electronics, offering thermal conductivity up to 1.5 W/m·K, good flow and low shrinkage. Selected grades add UL94 V-0 flame resistance and fast, low-stress curing. Part of our Fongyong range in Adhesives & Fluids.
Description
2K Silicone (Temperature Curing) is a two-component silicone potting and encapsulation material for electronic applications. It offers high thermal conductivity (up to 1.5 W/m·K), good fluidity, low shrinkage, and stable electrical properties. Certain grades provide UL94 V-0 flame resistance, fast curing with low internal stress, and high transparency for optical uses.
Applications
- Electronic potting and encapsulation
- Thermal management and heat-dissipating potting
- Flame-resistant potting applications
- Vibration and seismic isolation for electronic components
- Oztical and solar-related components
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