IC Encapsulation & Sealing Compound UL 94V-0
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IC Encapsulation & Sealing Compound UL 94V-0 is a flame-retardant material for sealing, potting and liquid IC encapsulation, with thermal conductivity up to 0.5 W/m·K and continuous operation up to 150 °C. Selected grades cure rapidly and withstand short peaks up to 280 °C. Part of our Fongyong range in Adhesives & Fluids.
Description
UL 94V-0 Irrigation and Sealing materials are designed for sealing, potting, and liquid-type IC encapsulation applications. They are UL 94 V-0 certified, offer reliable thermal conductivity up to 0.5 W/m·K, and maintain stable performance at continuous temperatures up to 150 °C. Selected grades feature rapid curing and short-term resistance to high temperatures up to 280 °C.
Applications
- Potting and sealing for electronic components
- Liquid IC encapsulation and protection
- SMT adhesive applications
- Engraving, marking, and removable printing processes
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