Therm-a-gap CIP 35 Thermally Conductive Cure-In-Place Compound
Therm-a-gap CIP 35 Thermally Conductive Cure-In-Place Compound is a two-component thermal interface material with 3.5 W/m-K conductivity. Dispensed in place, it fills complex gaps and uneven surfaces with low mechanical stress for power modules, automotive and LED electronics. Part of our Parker range in Adhesives & Fluids.
Description
Therm-a-gap CIP 35 is a two-component, cure-in-place (CIP) thermal interface material designed for efficient heat transfer in electronic systems. With a thermal conductivity of 3.5 W/m-K, it helps dissipate heat from components to heat sinks while maintaining low mechanical stress.
Its dispensable formulation allows it to conform to complex geometries and uneven surfaces, making it suitable for automated manufacturing and applications requiring flexible design and reliable thermal performance.
Key Features
- Thermal conductivity of 3.5 W/m-K for effective heat dissipation
- Cure-in-place design eliminates the need for pre-cut pads
- Silicone-based (VMQ, PVMQ) for flexibility and durability
- Enhanced with thermally conductive fillers for improved performance
- Ready-to-use cartridge system, no mixing or degassing required
- Conformable to irregular surfaces and tight spaces
Technical Specifications
| Property | Value |
|---|---|
| Thermal Conductivity | 3.5 W/m-K |
| Specific Gravity | 2.87 |
| Hardness | 55 Shore A |
| Viscosity | 5000 P |
| Operating Temperature | -55 to 200°C |
| Heat Capacity | 1 J/g-K |
| Coefficient of Thermal Expansion | 150 ppm/K |
| Dielectric Strength | 10 kVAC/mm |
| Volume Resistivity | 10¹⁴ ohm-cm |
| Dielectric Constant | 8 @ 1 MHz |
| Flammability Rating | UL 94 V-0 |
| Shelf Life | 12 months |
Typical Applications
- Semiconductor devices, ICs, and power modules
- Automotive electronics and EV battery systems
- Telecommunications and 5G equipment
- Consumer electronics (laptops, smartphones, gaming devices)
- LED lighting systems and power drivers
Advantages
- Fills gaps and uneven surfaces effectively
- Stable performance with low risk of material settling
- Provides vibration damping and reduces mechanical stress
- Compatible with automated dispensing systems
- Meets UL 94 V-0 safety standards
Application Process
- Clean surfaces before application
- Dispense using manual or automated systems
- Cure as required:
- 30 min @ 150°C
- 180 min @ 100°C
- 48 hours @ room temperature
- Inspect for uniform coverage
Therm-a-gap CIP 35 is suitable for applications requiring reliable thermal management, flexible application, and compatibility with modern electronics manufacturing processes.
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