AS-68805 Thermal Conductive Adhesive
AS-68805 Thermal Conductive Adhesive is a single-component, flame-retardant sealant that bonds, insulates and dissipates heat in electronic assemblies. It cures with ambient moisture, works from −40 °C to 200 °C and is RoHS compliant with UL94 V-0 certification. Part of our IBond range in Adhesives & Fluids.
Product overview AS-68805 Thermal Conductive Adhesive
AS-68805 is a high-viscosity, single-component, thermally conductive, flame-retardant adhesive sealant.
It is commonly used for electrical insulation, sealing, or bonding and coating applications in vehicles, ships, aircraft, glass, ceramics, and electronic equipment.
At room temperature, AS-68805 reacts with moisture in the air to form an elastomer without producing acetic acid. During curing, no corrosive by-products are generated, and therefore it does not corrode metals. After curing, it adheres well to most substrates.
The product features excellent resistance to heat, cold, and weathering, with an operating temperature range of −40 °C to 200 °C, and can also withstand instantaneous high temperatures up to 200 °C.
It also provides outstanding electrical insulation and adhesion properties.
AS-68805 contains no hazardous substances and complies with RoHS environmental protection requirements.
It is UL94 V-0 flame-retardant certified (E250052).
Technical specifications
| Item | Specification |
| Color | White |
| Viscosity (25°C, cps) | Paste |
| Density (g/cm³) | 1.75–1.85 |
| Surface Dry Time (min) | 5–10 |
| Curing Time (25°C, 1 mm, hrs) | 24 |
| Tensile Strength (MPa) ≥ | 2.6–2.8 |
| Elongation (%) ≥ | 70–90 |
| Shear Strength (MPa) ≥ | 1.1–1.3 |
| Shore A Hardness | 75 ± 5 |
| Dielectric Strength (kV/mm) ≥ | 20–24 |
| Volume Resistivity (ohm·cm) ≥ | 2.8–3.2 × 10¹³ |
| Dielectric Constant (60Hz) ≤ | 3.2–3.6 |
| Linear Thermal Expansion (cm/cm°C, 5°C–150°C) | 1.3–1.6 × 10⁻⁴ |
| Thermal Conductivity (W/m·K) | 0.8 ± 0.1 |
| Flame Rating UL94 | V-0 |
Applications
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Electronics: Attaching chips, ICs, or LEDs to heatsinks for efficient heat dissipation.
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Energy industry: Bonding battery modules or power electronics to cooling structures.
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LED lighting: Mounting high-power LEDs to heatsinks to enhance lifespan and performance.
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Automotive and aerospace: Securing sensors or electronic modules that require thermal management.
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Consumer electronics: Attaching circuit boards or processors to metal housings for better heat transfer.
