Tin-Lead Solder Preform Sn63Pb37
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Eutectic 183 °C preform with excellent wetting and thermal-fatigue life.
JST-PF-SN63 are eutectic Sn63Pb37 tin-lead solder preforms that melt sharply at 183 °C. They offer excellent wetting and thermal-fatigue life for RoHS-exempt products such as aerospace, defence and medical assemblies.
Key features
- Eutectic Sn63Pb37, melting point 183 °C
- Density 8.4 g/cm³, tensile strength 52 MPa
- Washers, discs, frames and ribbons
- Tape & reel or tray packaging
Typical applications
- RoHS-exempt high-reliability electronics
- Hermetic sealing and lids
- Repair of tin-lead assemblies
Specifications and documents
Full technical data is listed under Additional information. Technical data sheets (TDS) and safety data sheets (SDS) are available on request. Browse all solder preforms or contact our engineers for a recommendation, pricing and free samples.
Related guides
| Alloy | Sn63Pb37 |
|---|---|
| Melting point | 183 °C (eutectic) |
| Density | 8.4 g/cm³ |
| Tensile strength | 52 MPa |
| Shapes | Washer · disc · frame · ribbon |
| Packaging | Tape & reel · tray |
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