Water-soluble Solder Paste 769LF

Description

Delta Solder Paste 769LF is a zero-halogen, water-soluble solder paste designed for both air and nitrogen reflow applications. It is specifically developed for high melting temperature lead-free alloys such as SAC305 and Sn96.5/Ag3.5. The advanced flux system ensures strong thermal stability and prevents degradation during reflow in air atmosphere. The paste delivers consistent printing performance across a wide humidity range, excellent wettability, and reliable solderability, resulting in bright, shiny solder joints. It also offers low voiding, very low foaming, long tack time, extended stencil life, and enhanced print definition for fine-pitch applications. Classified as ORH0 under IPC-J-STD-004C, it ensures high reliability and cleanability with water-based cleaning systems.