Thermal-a-gap gel 35VT
Thermal-a-gap gel 35VT is a one-component, dispensable thermal interface gel with 3.5 W/m-K conductivity for efficient heat dissipation in modern electronics. It is easy to process and stays mechanically stable over the long term. Part of our Parker range in Adhesives & Fluids.
Product Overview
Thermal-a-gap gel 35VT is a one-component, dispensable thermal interface gel designed for high-performance thermal management in electronic systems. Developed for applications requiring efficient heat dissipation, it provides reliable thermal conductivity while maintaining ease of processing and long-term mechanical stability.
With a thermal conductivity of 3.5 W/m-K, the material effectively transfers heat from heat-generating components to heat sinks or enclosures, helping maintain optimal operating temperatures and system reliability. Its gel form enables it to conform to surface irregularities, minimizing thermal resistance across the interface.
Key Features
High Thermal Conductivity
Thermal conductivity of 3.5 W/m-K enables efficient heat transfer, reducing the risk of overheating in sensitive components.
Vibration and Pump-Out Resistance (VT Property)
Designed to maintain stability under vibration and vertical mounting conditions, ensuring consistent thermal contact over time.
One-Component, Ready-to-Use
No mixing or curing required, allowing immediate dispensing and simplifying production workflows.
High Tackiness & Gap Filling Ability
Adheres well to surfaces and effectively fills microscopic and macroscopic gaps between components and heat sinks.
Reworkable Material
Can be removed and reapplied, supporting maintenance, repair, and system upgrades.
Flexible Bond Line Thickness
Accommodates assembly tolerances while maintaining consistent thermal performance.
Technical Specifications
| Property | Value |
|---|---|
| Color | White |
| Specific Gravity | 2.9 |
| Heat Capacity | 1 J/g-K |
| Operating Temperature | -55 to 200°C (-40 to 302°F) |
| Volume Resistivity | 10¹³ ohm-cm |
| Dissipation Factor | 0.0002 @ 1 MHz |
| Outgassing (TML) | 0.135% |
| Outgassing (CVCM) | 0.0731% |
| Minimum Bond Line Thickness | 0.10 mm (0.004 inch) |
| Flow Rate | 23 g/min |
| Coefficient of Thermal Expansion | 150 ppm/K |
| Dielectric Strength | 7.9 VAC/mil |
| Dielectric Constant | 6.8 @ 100 kHz |
| Flammability Rating | UL 94 V-0 |
| Shelf Life | 12 months |
| Polymer Base | Silicone Rubber (VMQ, PVMQ) |
Typical Applications
- Telecommunications infrastructure equipment
- Battery Energy Storage Systems (BESS)
- Automotive electronics and ADAS modules
- Automotive sensors and radar systems
- Power electronics and power modules
- Consumer electronics (smartphones, tablets, gaming devices)
- Industrial electronic systems and control units
Advantages for Users
- Stable thermal performance in vibration-prone environments
- Efficient heat dissipation for high-power components
- Simplified manufacturing due to dispensable, no-cure formulation
- Flexible integration into various assembly processes
- Compliance with UL 94 V-0 and RoHS standards
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