Therm-a-gap gel 60HF Thermally Conductive Gel
Therm-a-gap gel 60HF Thermally Conductive Gel is a one-component silicone thermal gel with 6.2 W/m-K conductivity that moves heat from components to heat sinks. Its high flow rate of 80 g/min enables fast, precise automated dispensing. Part of our Parker range in Adhesives & Fluids.
Description
Therm-a-gap gel 60HF is a high-performance, one-component silicone-based thermal interface gel designed for efficient heat transfer in electronic systems. With a thermal conductivity of 6.2 W/m-K, it helps dissipate heat from components to heat sinks, ensuring stable operation and improved reliability.
Its high flow rate (80 g/min) enables fast, precise dispensing in both manual and automated production, making it ideal for high-volume manufacturing. The material is fully cured and ready to use, eliminating the need for secondary curing while allowing easy rework during maintenance.
Key Features
- Thermal conductivity of 6.2 W/m-K for efficient heat dissipation
- High flow rate (80 g/min) for fast and consistent dispensing
- One-component, no curing required
- Low thermal impedance for improved heat transfer
- Very low compression force to protect sensitive components
- Reworkable for repair and maintenance
- Room temperature storage for easy handling
Technical Specifications
| Property | Value |
|---|---|
| Color | Grey, Black |
| Flow Rate | 80 g/min |
| Specific Gravity | 3.3 |
| Thermal Conductivity | 6.2 W/m-K |
| Operating Temperature | -55°C to 200°C |
| Heat Capacity | 1 J/g-K |
| Coefficient of Thermal Expansion | 150 ppm/K |
| Dielectric Strength | 5 VAC/mil |
| Volume Resistivity | 10¹³ ohm-cm |
| Dielectric Constant | 5.8 @ 100 kHz |
| Dissipation Factor | 0.001 @ 1 MHz |
| Flammability Rating | UL 94 V-0 |
| Shelf Life | 12 months |
| Minimum Bondline Thickness | 0.15 mm |
| Material Type | Silicone Rubber (VMQ, PVMQ) |
Typical Applications
- Consumer electronics and compact devices
- Telecommunications equipment and networking systems
- Energy storage and battery modules
- Power electronics and high-current components
- Automotive electronics and control units
- Computing hardware (CPU, GPU, memory modules)
Advantages
- Optimized for automated, high-volume dispensing processes
- Stable performance across wide temperature ranges
- Reduces mechanical stress on PCBs and solder joints
- Easy storage and handling without special conditions
- Consistent and reliable thermal interface performance
Therm-a-gap gel 60HF is a suitable solution for applications requiring high thermal conductivity, fast dispensing, and reliable long-term performance in modern electronics manufacturing.
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