No-Clean Solder Paste SAC305 · Type 4
Currency:
Language
Prices in USD — currency follows the "Ship to" country.
Fine-pitch printing, excellent wetting, low voiding.
JST-SP305-T4 is a lead-free SAC305 (Sn96.5Ag3.0Cu0.5) no-clean solder paste with Type 4 powder (20–38 µm). It is our standard choice for fine-pitch SMT lines that need consistent printing, good wetting and low voiding without a cleaning step.
Key features
- Type 4 powder prints fine-pitch ICs, 0.5 mm BGAs, QFNs and 0201 parts
- ROL0 no-clean flux — residue is safe to leave on most boards
- SAC305 alloy, melting range 217–219 °C, RoHS-compliant
- Stable stencil life for long production runs
Typical applications
- Fine-pitch SMT reflow
- BGA, QFN and LGA assembly
- Automotive, industrial and consumer electronics
Specifications and documents
Full technical data is listed under Additional information. Technical data sheets (TDS) and safety data sheets (SDS) are available on request. Browse all solder paste or contact our engineers for a recommendation, pricing and free samples.
Related guides
| Alloy | Sn96.5Ag3.0Cu0.5 |
|---|---|
| Powder size | Type 4 (20–38 µm) |
| Flux | ROL0 · No-Clean |
| Melting point | 217–219 °C |
| Packaging | 500 g jar |
| Storage | 2–10 °C |
Reviews
There are no reviews yet.