Water-soluble Solder Paste 788

Description

Delta® Solder Paste 788 is a halide-free, water-soluble solder paste designed for Sn/Pb surface mount and electronic assembly applications. It features excellent slump resistance and uses a low-volatility solvent system, providing a long tack time of over 8 hours. The paste offers high tack force, is non-hygroscopic, and ensures stable printing performance with extended stencil life. After soldering, flux residues can be easily removed using warm deionized (DI) water cleaning systems.

Applications

• SMT stencil printing using Sn63/Pb37 solder paste
• Surface mount soldering with eutectic Sn/Pb alloys
• PCB assembly processes requiring high slump resistance and long tack time
• SMT production lines using water-soluble flux with post-reflow cleaning
• Electronic assemblies where flux residues must be easily removed with DI water
• General electronics manufacturing, SMT & PCBA assembly, and Sn/Pb assembly processes requiring cleaning after reflow