JS-SP0307 is a low-silver SAC0307 no-clean solder paste (Sn99/Ag0.3/Cu0.7). Its very low silver content makes it one of the most economical lead-free pastes for general SMT assembly.
Key features
- SAC0307 alloy with only 0.3 % silver
- Lowest-cost lead-free SAC option
- No-clean flux, RoHS-compliant
- Supplied in 500 g jars
Typical applications
- General SMT and consumer electronics
- High-volume, cost-sensitive production
Specifications and documents
Full technical data is listed under Additional information. Technical data sheets (TDS) and safety data sheets (SDS) are available on request. Browse all solder paste or contact our engineers for a recommendation, pricing and free samples.




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