12-Zone Lead-Free Hot Air Reflow Oven JA-F12
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The 12-Zone Lead-Free Hot Air Reflow Oven JA-F12 is built with premium components, including aluminum alloy nozzle plates, imported high-temperature motors and hardened rails. It delivers even heating and long service life on high-volume SMT lines. Part of our Reflow Oven range in Soldering Solutions.
Carefully Selected Materials — Component Quality Highlights
| Component / Material | Quality Details |
| Aluminum Alloy Nozzle Plate | Latest-design aluminum alloy nozzle plate with porous structure for uniform hot air distribution. Superior insulation performance eliminates the ‘shadow effect’, ensuring even heat transfer to all components across the full PCB width. |
| Plug-In Imported High-Temp Motors | Each heating zone is driven by an imported high-temperature motor with a plug-in modular design — allowing full replacement in under 5 minutes without tools. Ensures long service life, low noise, and shockless operation. |
| Siemens PLC Module Circuit | Siemens-brand PLC with modular circuit design for high stability and repeatability. If the IPC fails, the PLC continues offline without stopping production, protecting every board in the oven. |
| Hardened Rail Track | Rail tracks are processed with an industrial hardening treatment for enhanced dimensional stability and wear resistance — extending rail service life under continuous high-temperature production conditions. |
| High-Density Insulation Material | New energy-saving furnace construction with high-density thermal insulation on all 4 sides. Dramatically reduces heat loss, shortens warm-up time to ~20 minutes, and cuts normal running power to ~12 kW. |
| Special Stainless Steel Mesh Belt | Heavy-duty stainless steel mesh belt with tensioning device ensures smooth, shake-free, non-deforming PCB transport. Durable and wear-resistant, rated for continuous high-temperature operation over long service intervals. |
| Aluminum Alloy Conveyor Structure | Synchronous guide transmission mechanism made from aluminum alloy provides precise, stable rail width adjustment and seamless inline connection with upstream/downstream SMT equipment. |
| Large-Current Imported SSR | Hot air heating output uses imported large-current Solid State Relays (SSR) with dedicated radiators, ensuring safe, contact-free switching, improved cooling efficiency, and extended SSR service life versus standard relays. |
Product Description
The JA-F12 SMT Reflow Soldering Oven is a large-capacity, 12-zone lead-free hot air reflow oven built with carefully selected, premium-grade materials throughout — from its imported plug-in high-temperature motors and aluminum alloy nozzle plates, to its hardened rail tracks, imported large-current SSRs, and high-density insulation furnace construction. Every component is chosen to maximize machine longevity, process stability, and solder joint quality.
Designed for demanding, high-volume SMT production lines, the F12 features 24 independent heating elements (UP 12 / BOTTOM 12) with a 4-sided return air convection system, Siemens PLC + IPC dual-control architecture with offline fallback, and a new energy-saving furnace design that reaches working temperature in just ~20 minutes. The F12 delivers consistently superior thermal profiles for the full range of lead-free SMT components — backed by the quality of materials that set it apart from standard-grade alternatives.
Key Features
| Key Feature | Description |
| 12 Heating Zones, 24 Elements | UP 12 / BOTTOM 12 independent heating elements with 4-side return air circulation for best-in-class temperature uniformity. Each zone has independent temperature control and switch for precision thermal profiling. |
| New Energy-Saving Furnace Design | 4-sided return air design combined with premium insulation materials minimizes thermal loss, reduces warm-up time to ~20 minutes, and keeps normal running power as low as ~12 kW during continuous production. |
| Siemens PLC + Professional IPC | Dual-control: Siemens PLC + IPC on Windows 7 with English/Chinese bilingual interface. PLC offline fallback protects production if IPC has issues. Supports 80 GB data storage and full profile printout. |
| Automatic Cylinder Body Lifting | The furnace body lifts automatically via cylinder, ensuring safe and convenient access to the internal heating chamber for cleaning, inspection, and maintenance. |
| Axial Fan Forced Dual Cooling | Independent axial fan forced-air cooling zones (up and bottom dual cooling) provide rapid, uniform heat extraction from PCBs after reflow — preventing component damage and board warpage. |
| UPS + Auto Delay Shutdown | Built-in UPS and automatic delay shutdown system protect PCBs and the machine in power failure or overheat events. Temperature and transmission speed out-of-tolerance alarms provide real-time process protection. |
| Screw Width Adjustment | Super-positioning flexible and convenient screw width adjustment system enables quick, precise rail width changes to accommodate different PCB sizes — minimizing changeover time on the line. |
| Nitrogen Option Available | Optional nitrogen atmosphere module for oxide-free, low-void soldering — suitable for high-reliability applications requiring inert atmosphere reflow of BGA, QFN, and other sensitive packages. |
Technical Specifications
| Specification | Details |
| Model | JA-F12 |
| Machine Type | Large-Size SMT Lead-Free Hot Air Reflow Soldering Oven |
| Condition | New |
| Warranty | 12 Months |
| Heating Zones | UP 12 / BOTTOM 12 (24 elements total) |
| Heating Zone Length | 4,640 mm |
| Heating Mode | Hot Air — 4-Side Return Air Full Convection |
| Nozzle Plate Material | Aluminum Alloy (latest design, best insulation performance) |
| Cooling Zones | UP 2 / BOTTOM 2 (axial fan forced air) |
| Max. PCB Width | 400 mm |
| Mesh Belt Width | 450 mm |
| Rail Width Range | 50 – 400 mm (screw adjustment) |
| Conveyor Speed | 0 – 2,000 mm/min (stepless, ±2 mm/min accuracy) |
| Conveyor Direction | Left to Right (Right to Left optional) |
| Conveyor Height | 900 ± 20 mm |
| Transmission Type | Stainless steel mesh belt and hardened chain |
| Component Clearance | Top and bottom 25 mm |
| Power Supply | 5-line, 3-phase 380V 50/60 Hz |
| Total Power | 56 kW |
| Starting Power | 48 kW |
| Normal Power Consumption | ~12 kW (during production) |
| Warm-up Time | ~20 minutes to working temperature |
| Temp. Setting Range | Room temperature to 300°C |
| Temp. Control Method | PID closed-loop control + SSR (imported large-current) |
| Temp. Control Precision | ±1°C |
| Temp. Deviation on PCB | ±2°C |
| Control System | Siemens PLC + Professional IPC (offline fallback) |
| OS / Interface | Windows 7; Chinese & English bilingual |
| Data Storage | Process data and status storage (80 GB) |
| Alarm System | Temp. out-of-tolerance (high/low), board-dropped alarm; Tower light: Yellow=Warning, Green=Normal, Red=Abnormal |
| Protection | IPC + UPS; auto delay shutdown on power failure or overheat |
| Machine Dimensions (L×W×H) | ~6,600 × 1,420 × 1,580 mm |
| Machine Weight | ~2,000 kg |
| Color | Computer Gray |
| Nitrogen Option | Available (optional) |
| Certification | CE, CCC, ISO 9000, RoHS |
| Place of Origin | Shenzhen, Guangdong, China |
Applications
- High-volume SMT PCB assembly lines requiring premium material quality and long machine service life
- Lead-free soldering of BGA, QFN, LGA, fine-pitch, and 0201 surface-mount components
- Mixed-technology PCB assembly (SMT + THT) with complex, demanding thermal profiles
- Automotive electronics: ECUs, ADAS modules, LED lighting, and EV battery management PCBs
- Aerospace and defense high-reliability PCB assemblies
- Medical device PCBs requiring precise process control and full data traceability
- Industrial automation: control boards, servo drives, power electronics, and relay modules
- Telecommunications, 5G infrastructure, and networking equipment PCB production
- LED driver boards, display panels, and consumer electronics manufacturing
Industries Served
- Consumer electronics and smart device manufacturing
- Automotive electronics (ECUs, ADAS, EV systems, LED lighting)
- Aerospace & defense high-reliability PCB manufacturing
- Medical devices and life sciences electronics
- Industrial automation, power electronics, and control systems
- Telecommunications, networking, and 5G infrastructure
- LED lighting and display panel production
- Contract electronics manufacturing (EMS / PCBA services)
