8-Zone Lead-Free Nitrogen Reflow Oven JA-R8-N
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The 8-Zone Lead-Free Nitrogen Reflow Oven JA-R8-N adds a built-in nitrogen atmosphere to the R8 platform for better wetting and minimal voiding. 16 independent heating elements keep temperature uniform across the PCB. Part of our Reflow Oven range in Soldering Solutions.
Key Features
| Key Feature | Description |
| Patented Air Management System | 8 couples of top and bottom heating zones with a patented air management structure deliver more efficient full-convection hot air circulation and faster thermal compensation — ensuring exceptional ΔT uniformity across the entire PCB surface. |
| Built-In Nitrogen (N₂) Atmosphere | Integrated nitrogen atmosphere system (R8-N) maintains an inert environment inside the oven, preventing oxidation, minimizing voiding, and delivering superior solder joint wettability — critical for high-reliability automotive, aerospace, and medical assemblies. |
| Siemens PLC + IPC Dual Control | Siemens PLC combined with a professional Industrial PC (IPC) running Windows 7 provides rock-solid process stability with bilingual (Chinese/English) interface. If the IPC crashes, the PLC continues in offline mode — production is never interrupted. |
| Intelligent Diagnostic System (IDS) | Built-in IDS monitors the process in real time, providing trouble reminders, fault alerts, alarm list-out, SPC data records, and report-saving capabilities — enabling full process traceability and rapid troubleshooting. |
| Independent Zone Temp. & Blower Control | Each of the 8 heating zones has independently controllable temperature and blower speed — allowing fine-tuned thermal profiling for complex BGA, CSP, 0201, and mixed-technology assemblies to meet the most demanding lead-free process windows. |
| Step Forced Cooling System | 3 independent forced-air cooling zones achieve a cooling slope of ≥3°C/sec — easily meeting strict lead-free process requirements and preventing component warpage or thermal stress on exit. |
| Hardened Rail Track System | Rail tracks are hardened for long-term reliability and dimensional stability. Manual width adjustment is standard; automatic adjustment via SPG gear motor is available as an option. Computerized rail chain lubrication extends maintenance intervals. |
| Plug-In Modular Heating Elements | Heating elements feature a plug-in modular design for rapid replacement without specialized tools — minimizing planned and unplanned maintenance downtime on the production line. |
| Flux Removal Unit | Integrated flux management and removal unit captures and manages flux residue inside the oven — maintaining oven cleanliness, meeting environmental protection requirements, and extending service intervals. |
| Powerful Software & Data Logging | Full-featured software platform supports saving all temperature and speed settings, profile storage and recall, SPC data logging (80 GB), and complete data printout capability for process documentation and quality audits. |
Product Description
The JA-R8-N is a high-end, 8-zone lead-free hot air reflow oven with a built-in nitrogen (N₂) atmosphere system — designed for demanding SMT production lines where superior solder joint reliability and minimal voiding are non-negotiable. Featuring JIT’s patented air management structure across 16 independent heating elements (UP 8 / BOTTOM 8), the R8-N delivers class-leading temperature uniformity and thermal compensation across the full PCB width.
The integrated nitrogen system maintains an oxygen level below 1,000 ppm inside the soldering chamber, preventing oxidation of solder and pad surfaces and achieving ultra-low void rates — critical for automotive, aerospace, medical, and high-frequency electronics. Combined with Siemens PLC + IPC dual-control architecture, an Intelligent Diagnostic System (IDS), 3-zone step forced cooling, and a comprehensive software platform with SPC data logging, the R8-N represents the benchmark for high-precision, high-reliability lead-free reflow soldering.
Technical Specifications
| Specification | Details |
| Model | JA-R8-N |
| Machine Type | High-End Lead-Free Hot Air Reflow Oven with Nitrogen |
| Condition | New |
| Warranty | 12 Months |
| Heating Zones | UP 8 / BOTTOM 8 (16 elements total, patented air management) |
| Heating Zone Length | 3,121 mm |
| Heating Mode | Full Convection Hot Air |
| Cooling Zones | 3 independent forced-air cooling zones |
| Cooling Slope | ≥ 3°C / sec |
| Max. PCB Width | 400 mm (chain); mesh belt width 450 mm |
| Rail Width Range | Adjustable (manual standard; SPG gear motor auto optional) |
| Conveyor Speed | 0 – 2,000 mm/min (stepless) |
| Conveyor Direction | Left to Right (Right to Left optional) |
| Conveyor Height | 900 ± 20 mm |
| Transmission Type | Mesh belt and chain |
| Component Clearance | Top 25 mm / Bottom 25 mm |
| Rail Lubrication | Computerized controlled chain lubrication |
| Power Supply | 5-line, 3-phase 380V 50/60 Hz |
| Start-up Power | 58 kW |
| Warm-up Power | 50 kW |
| Normal Power Consumption | ~12–15 kW (during production) |
| Warm-up Time | ~20 minutes to working temperature |
| Temp. Setting Range | Room temperature to 300°C |
| Temp. Control Method | PID closed-loop control + SSR driving |
| Temp. Control Precision | ±1°C |
| Temp. Deviation on PCB | ±2°C |
| Control System | Siemens PLC + Professional IPC |
| OS / Interface | Windows 7; Chinese & English bilingual |
| Data Storage | SPC data record & status storage (80 GB) |
| Nozzle Plate | Aluminum Alloy (latest design) |
| Nitrogen System | Built-in nitrogen atmosphere (R8-N standard); N₂ pipes + oxygen analyzer included |
| Nitrogen Consumption | ~16 m³/hr at ≤1,000 ppm O₂ (approx.) |
| Package Dimensions (L×W×H) | 5,860 × 1,380 × 1,520 mm |
| Machine Weight | 2,650 kg |
| Color | Computer Gray |
| Optional Accessories | Water chiller, center board support, dual-rail option, auto rail width adjustment |
| Certification | CE, CCC, ISO 9000, RoHS |
| Place of Origin | Shenzhen, Guangdong, China |
Applications
- High-reliability SMT PCB assembly requiring superior lead-free solder joint integrity (BGA, CSP, QFN, 0201)
- Nitrogen-atmosphere reflow for oxide-sensitive assemblies and ultra-low void rate requirements
- Automotive ECU, ADAS module, EV battery management, and LED lighting PCB production
- Aerospace and defense high-reliability PCB assemblies requiring MIL-spec solder joint quality
- Medical device PCBs with strict reliability and process traceability requirements
- Power electronics: IGBT modules, DC-DC converters, power modules requiring inert atmosphere soldering
- Telecommunications, 5G infrastructure, and high-frequency PCB assemblies
- Industrial automation control boards, servo drives, and precision sensor assemblies
- Consumer electronics with complex mixed-technology and fine-pitch component requirements
Industries Served
- Automotive electronics (ECUs, ADAS, EV systems, LED lighting)
- Aerospace & defense high-reliability PCB manufacturing
- Medical devices and life sciences electronics
- Industrial automation, power electronics, and robotics
- Telecommunications, networking, and 5G infrastructure
- Consumer electronics and smart device manufacturing
- LED lighting and display panel production
- Contract electronics manufacturing (EMS / PCBA services)
| Weight | 2650 kg |
|---|---|
| Dimensions | 586 × 138 × 152 cm |
