Solder Paste Inspection Machine
34,750.00 $
The Solder Paste Inspection Machine (SPI) captures 3D images to measure solder paste volume, height, area and shape after printing. It catches defects before component placement and supports Gerber import for quick programming. Part of our Inspection Machine range in Counter & Inspection Solutions.
Product overview
The Solder Paste Inspection (SPI) Machine is an advanced inline inspection solution designed to ensure high-quality solder paste printing in SMT production. By capturing precise 3D images and analyzing solder paste volume, height, area, and shape, the system helps manufacturers detect and correct printing defects early in the process — before component placement.
With its professional optical design, powerful data processing, and intelligent software algorithms, this SPI system provides fast, accurate, and reliable inspection results for both high-mix and high-volume manufacturing environments.
Key Features and Technologies
- Professional Optical Lens Design: The advanced optical lens system ensures a uniform, high-resolution image output, delivering more delicate details and significantly improving detection stability.
- Flexible Programming Options: Supports direct Gerber file import for automatic programming, or manual image-based editing and debugging for quick setup and fine adjustments.
- Multi-Directional 3D Projection Technology: Utilizes multiple angled projections to effectively eliminate shadow effects, ensuring accurate height and volume measurements during solder paste inspection.
- User-Friendly Operating System: The intelligent software interface adapts to user levels, enhancing result recognition, data processing, and overall operational efficiency.
- High-Precision Moiré Fringe Measurement: Equipped with programmable black-and-white moiré fringe technology, achieving measurement accuracy up to 0.67 μm for ultra-fine pitch applications.
- Comprehensive 3D Data Analysis: Based on precise 3D measurement data, operators can quickly analyze defects, optimize process parameters, and improve production yield within a short time.
Technical specifications
| Specification | Detail |
| PCB Size | 55 × 55 ~ 460 × 460 mm |
| PCB Thickness | 0.5 ~ 7.0 mm |
| PCB Weight | ≤ 5.0 kg |
| Conveyor Adjustment | Manual/automatic |
| Measure Type | Height, Area, Volume, Offset, Bridge, Shape (missing print, insufficient tin, excessive tin, bridging, offset, mal-shapes, surface contamination) |
| Paste Height | 0 ~ 550 µm |
| Min Pad Pitch | ≥ 100 µm |
| Measure Principle | 3D white light PSLM PMP (Programmable Spatial Light Modulation, Phase Measurement Profilometry) |
| Inspection Head Quantity | 1 |
| Camera Pixel | 5M (10M/12M as option) |
| Detection Speed | 0.35 ~ 0.5 s/FOV |
| Program Time | 5 ~ 10 min |
| Data Type | Gerber Data 274D/274X, Scan PCB |
| Power | AC220V, 50/60 Hz, 1 KVA |
| Machine Dimension | 1000 × 1150 × 1530 mm |
| Weight | 965 kg |
Applications
The SPI machine is ideal for solder paste quality control in SMT assembly lines across a wide range of industries, including:
- Consumer electronics
- Automotive electronics
- Industrial control systems
- Communication equipment
- Medical and aerospace electronics
It supports various PCB types — from fine-pitch boards and BGA layouts to ultra-thin and flexible substrates — ensuring comprehensive process quality assurance.
