Water-Soluble Solder Paste SAC305 · Type 4
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High activity, residues clean easily with DI water.
JST-SPWS-T4 is a water-soluble SAC305 solder paste with Type 4 powder and high-activity ORH1 flux. It wets difficult surfaces well, and its residue is removed completely in a DI-water wash — ideal when boards must be clean before coating or underfill.
Key features
- High-activity ORH1 flux for oxidised or hard-to-wet finishes
- Residue washes off with DI water
- Type 4 powder (20–38 µm) for fine pitch
- SAC305 lead-free alloy, 217–219 °C
Typical applications
- High-reliability and medical electronics
- Boards that are conformal coated or underfilled
- Fine-pitch SMT with an inline wash
Specifications and documents
Full technical data is listed under Additional information. Technical data sheets (TDS) and safety data sheets (SDS) are available on request. Browse all solder paste or contact our engineers for a recommendation, pricing and free samples.
Related guides
| Alloy | Sn96.5Ag3.0Cu0.5 |
|---|---|
| Powder size | Type 4 (20–38 µm) |
| Flux | ORH1 · Water-Soluble |
| Melting point | 217–219 °C |
| Packaging | 500 g jar |
| Storage | 2–10 °C |
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