No-Clean Solder Paste SAC305 · Type 3
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Standard SMT printing for general assemblies.
JST-SP305-T3 is a lead-free SAC305 no-clean solder paste with Type 3 powder (25–45 µm) — a cost-effective paste for general SMT assemblies where the smallest parts are 0402 and pitch is 0.65 mm or more.
Key features
- Type 3 powder for standard stencil apertures
- ROL0 no-clean flux, no washing step required
- SAC305 alloy, melting range 217–219 °C
- Lower cost than finer powder types
Typical applications
- General SMT reflow
- 0603 / 0402 passives and standard ICs
- Pin-in-paste through-hole reflow
Specifications and documents
Full technical data is listed under Additional information. Technical data sheets (TDS) and safety data sheets (SDS) are available on request. Browse all solder paste or contact our engineers for a recommendation, pricing and free samples.
Related guides
| Alloy | Sn96.5Ag3.0Cu0.5 |
|---|---|
| Powder size | Type 3 (25–45 µm) |
| Flux | ROL0 · No-Clean |
| Melting point | 217–219 °C |
| Packaging | 500 g jar |
| Storage | 2–10 °C |
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