No Clean Lead Free Solder Paste – JS-SP305
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SAC305 no-clean lead-free solder paste — the industry-standard alloy for reliable SMT reflow.
JS-SP305 is a no-clean lead-free solder paste based on the SAC305 alloy (Sn96.5/Ag3/Cu0.5), the most widely used lead-free solder in SMT. It delivers strong, reliable joints across a wide range of boards and components.
Key features
- SAC305 alloy — the industry-standard lead-free choice
- No-clean flux, no washing required
- RoHS-compliant
- Supplied in 500 g jars
Typical applications
- General and fine-pitch SMT reflow
- Consumer, industrial and automotive electronics
Specifications and documents
Full technical data is listed under Additional information. Technical data sheets (TDS) and safety data sheets (SDS) are available on request. Browse all solder paste or contact our engineers for a recommendation, pricing and free samples.
Related guides
| Alloy | Sn96.5/Ag3/Cu0.5 |
|---|---|
| Flux | No-Clean · Lead-Free |
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