No Clean Lead Free Solder Paste – JS-SP105
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Low-silver SAC105 no-clean lead-free solder paste — balancing cost and joint reliability.
JS-SP105 is a low-silver SAC105 no-clean solder paste (Sn98.5/Ag1/Cu0.5). With one third of the silver of SAC305, it lowers material cost while keeping good joint reliability and drop-shock performance.
Key features
- Low-silver SAC105 alloy reduces paste cost
- Good drop and shock resistance
- No-clean flux, lead-free and RoHS-compliant
- Supplied in 500 g jars
Typical applications
- Cost-sensitive SMT production
- Portable and handheld electronics
Specifications and documents
Full technical data is listed under Additional information. Technical data sheets (TDS) and safety data sheets (SDS) are available on request. Browse all solder paste or contact our engineers for a recommendation, pricing and free samples.
Related guides
| Alloy | Sn98.5/Ag1/Cu0.5 |
|---|---|
| Flux | No-Clean · Lead-Free |
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