Low temperature epoxy adhesive
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Low temperature epoxy adhesive is a single-component modified epoxy that cures at low temperatures, making it ideal for bonding heat-sensitive parts such as memory cards, CCD/CMOS modules and LED backlight lenses. It delivers strong bonds with minimal thermal stress. Part of our IBond range in Adhesives & Fluids.
Features
– Single-component modified epoxy resin adhesive
– Used for low temperature thermal curing and can form the best bonding force between various materials
Applications
– Mainly used in: memory cards, CCD/CMOS, LED backlight lens bonding and other devices, especially suitable for the assembly and bonding of heat-sensitive components that require low temperature curing.
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