High-Temp Solder Preform Pb92.5Sn5Ag2.5
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High-temperature soft solder for die-attach and high-power devices.
JST-PF-HT925 are high-temperature solder preforms in Pb92.5Sn5Ag2.5 alloy (solidus 287 °C, liquidus 296 °C). The high melting range lets die-attach joints survive later SMT reflow without remelting.
Key features
- Solidus 287 °C / liquidus 296 °C
- Density 11.02 g/cm³, tensile strength 29 MPa
- Ideal for step soldering hierarchies
- Tray or vial packaging
Typical applications
- Die-attach for power semiconductors
- IGBT and power modules
- High-temperature assemblies
Specifications and documents
Full technical data is listed under Additional information. Technical data sheets (TDS) and safety data sheets (SDS) are available on request. Browse all solder preforms or contact our engineers for a recommendation, pricing and free samples.
Related guides
| Alloy | Pb92.5Sn5Ag2.5 |
|---|---|
| Solidus / Liquidus | 287 °C / 296 °C |
| Density | 11.02 g/cm³ |
| Tensile strength | 29 MPa |
| Application | Die-attach · power modules |
| Packaging | Tray · vial |
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