AB Epoxy Automatic Potting Machine JA-SEC-S3030-C
42,000.00 $
The AB Epoxy Automatic Potting Machine JA-SEC-S3030-C mixes and dispenses two-component epoxy, silicone and polyurethane with ±2% accuracy. A bilingual touch screen stores up to 100 programs, and the XYZ platform handles dots, lines and arcs. Part of our Automatic Dispensing Machine range.
Product overview
The Automatic 2-Part Materials Mixing and Potting Machine is a high-performance system designed for precise mixing and dispensing of two-component adhesives such as epoxy, silicone, and polyurethane.
It features a user-friendly bilingual touch screen interface (Chinese/English), intelligent control software, and a robust XYZ servo-driven platform for stable and accurate operation.
With advanced metering technology and a dynamic/static mixing system, the machine ensures consistent ratio control (from 100:100 to 100:10), bubble-free potting, and high production efficiency.
Its modular design allows flexible customization for different adhesive types and product dimensions — making it ideal for medium to large-scale encapsulation production.
Key Features and Technologies
- User-Friendly Interface: Touch screen HMI supports bilingual operation, easy programming, and storage for up to 100 glue parameter sets.
- High Precision Dispensing: Adjustable filling speed, timing, and volume with ±2% accuracy to prevent leakage or uneven glue output.
- Flexible 3D Motion: Supports dot, line, arc, and circular dispensing with three-axis linkage for complex shapes.
- Efficiency Upgrade: One system can achieve the output equivalent to 5–6 manual operators.
- Advanced Mixing System: Real-time ratio control with optional side-mixing during filling to minimize adhesive waste.
- Smart Control: Not affected by pressure fluctuations — avoids uneven coating, air bubbles, or stringing.
- Safety & Monitoring: Equipped with liquid level sensors and automatic low-material alarm.
- Optional Functions: Glue heating, vacuum defoaming, and stirring available for different material requirements.
This compact yet flexible dispensing system reduces production waste, lowers maintenance cost, and improves process reliability for modern electronic manufacturing lines.
Technical specifications
| Working Range (X/Y/Z) | 400 × 300 × 100 mm |
|---|---|
| Travel Speed | 0–500 mm/s |
| Mixing Accuracy | ±2% |
| Dispensing Accuracy | ±2% |
| Mixing Ratio | Adjustable 100:100 – 100:10 |
| Dispensing Speed | 1–30 g/s |
| Metering Method | Stepper/Servo Motor with Plunger or Screw Pump |
| Transfer Method | Servo Motor + Ball Screw |
| Working Viscosity | ≤100,000 CPS |
| Power Supply | AC380V / 50Hz / 3.0kW |
| Machine Dimensions | 2350(L) × 1600(W) × 2100(H) mm |
| Machine Weight | Approx. 600–800 kg |
| Operating Environment | Humidity: 20–90%, Temp: 0–40°C |
| Vision System | High-definition CCD camera |
| Control System | Windows-based PC with control software |
| Communication Protocol | SMEMA compatible |
| Air Pressure | 0.65 MPa ± 0.02 MPa, 0.2 m³/h |
Main Components:
- Industrial PC + Monitor (DELL)
- XYZ servo robotic platform
- Dual material tanks (independent storage)
- Dual metering pumps (screw/gear/piston type)
- Static or dynamic mixing valve
- Automatic valve cleaning tank
- Imported vacuum pump
Applications
The automatic potting and dispensing system is widely used in electronics and electrical manufacturing, where precise ratio mixing and bubble-free filling are essential.
Typical Applications:
- Electronic components, PCB & wire boards
- Lighting products and LED modules
- Igniters and sensors
- Battery packs and filter products
- Vacuum cleaner and small appliance components
- Automotive and vehicle electronics
- General industrial encapsulation and sealing tasks
Compatible Materials:
- AB Glue, Epoxy Resin, Silicone, RTV, UV Glue
- EMI Conductive Glue, Thermal Paste, Red Glue, Silver Glue
- Solder Paste, Solder Mask, Instant Glue, Clear Paint, Screw Fixer, etc.
