No Clean Flux 302

Description

302 No Clean Flux is a halogen-free, low-solid, organic flux designed for wave soldering of both conventional and surface mount PCB assemblies. It features a homogeneous formulation that delivers excellent wetting and strong fluxing activity, producing bright, shiny solder joints with minimal residue. The flux provides superior and stable foaming characteristics, ensuring uniform flux application during processing. Being rosin- and resin-free, it is ideal for clean, high-efficiency production environments. It is compatible with both leaded and lead-free solder systems, supporting flexible manufacturing requirements.

Applications

• Wave soldering for through-hole and surface mount PCB assemblies
• Mass production using foam, spray, wave, or drop-jet fluxing methods
• Lead-free and leaded soldering processes (SnAgCu, SnAg, SnCu, SnSb, Sn63/Pb37)
• Electronics manufacturing environments requiring no-clean processes
• High-throughput production lines requiring uniform flux deposition and stable performance
• Applications sensitive to residue, benefiting from low-solid, rosin-free formulations
• SMT and mixed-technology PCBA assembly lines requiring consistent foaming and reliable soldering performance