Vacuum Reflow Oven Soldering Machine
The Vacuum Reflow Oven Soldering Machine reflows under vacuum as low as 2 mbar, eliminating voids and oxidation for high-reliability joints. Separate heating, vacuum and cooling zones suit automotive, aerospace and medical electronics. Part of our Reflow Oven range in Soldering Solutions.
Key Features
| Key Feature | Description |
| Vacuum Soldering Environment | Performs reflow soldering under vacuum (as low as 2 mbar), effectively eliminating voids, air inclusions, and oxidation — delivering defect-free, high-reliability solder joints critical for automotive, aerospace, and medical electronics. |
| Three-Stage Transport System | Independent heating zone, vacuum zone, and cooling zone allow individually adjustable process control for each stage — ensuring optimal thermal profile, void reduction, and safe board cooling in a single continuous pass. |
| Automatic Furnace Lid Opening | Motorized automatic lid opening system on the vacuum chamber facilitates quick, safe access for cleaning, maintenance, and changeover — minimizing downtime and improving operational efficiency. |
| 5 HP Water Cooling System | Equipped with a high-performance 5 HP water cooler for the cooling zone, ensuring rapid and uniform heat dissipation from PCBs after soldering to prevent thermal stress and component damage. |
| Efficient Flux Recovery System | Integrated flux recovery and management system prevents rosin residue buildup inside the chamber — reducing cleaning frequency and maintaining process cleanliness. |
| Fast Production Cycle | Average production cycle of 40–60 seconds per board enables high-throughput continuous production, meeting the demands of both small-batch and large-volume SMT lines. |
| PLC + PC Control System | Dual-architecture control (PLC + computer interface) with vacuum profile editing capability, real-time monitoring, and data logging for full traceability and process repeatability. |
| Lead-Free & RoHS Compliant | Fully supports lead-free (SAC alloy) soldering processes in compliance with RoHS and international environmental standards, as well as traditional Sn-Pb processes where required. |
Product Description
The Vacuum Reflow Oven Soldering Machine is an advanced, high-precision soldering solution engineered for demanding SMT (Surface Mount Technology) PCB assembly lines. By performing the reflow soldering process in a controlled vacuum environment, this machine effectively eliminates air pockets, reduces oxidation, and minimizes void formation in solder joints — resulting in superior joint integrity, mechanical strength, and electrical performance.
Designed for high-throughput, high-reliability production, the machine features a three-stage transport system (heating zone, vacuum zone, and cooling zone), an automatic furnace lid opening system for easy maintenance, and PLC-based precise process control. Its three-phase 380V power supply and 1,000W rated capacity deliver consistent, energy-efficient performance across diverse PCB formats — from consumer electronics to automotive, aerospace, and medical device applications.
Technical Specifications
| Specification | Details |
| Voltage | 380 V |
| Type | Automatic Solders (Vacuum Reflow) |
| Condition | New |
| Warranty | 1 Year |
| Rated Capacity | 1000 W |
| Current | 100 A |
| Place of Origin | Guangdong, China |
| Brand Name | JIT |
| Machine Dimensions | 6600 × 1670 × 1570 mm |
| Machine Weight | 4300 kg |
| Vacuum Degree | 1 ~ 10 mbar |
| Belt Width | 500 mm |
| Heating Time | 45 minutes |
| Transport Speed | 300 – 2,000 mm/min |
| Heating Zones | UP 10 / BOTTOM 10 (20 zones total) |
| Heating Zone Length | 3,500 mm |
| Transport System | Three-stage: Heating Zone → Vacuum Zone → Cooling Zone |
| Production Cycle | 40 – 60 seconds (average) |
| Cooling System | 5 HP Water Cooler |
| Control System | PLC + PC / Touch Screen |
| Solder Type | Lead-Free (SAC) / Sn-Pb |
| Certification | CE, ISO 9000, RoHS |
Packaging & Delivery
| Parameter | Details |
| Selling Units | Single item |
| Single Package Size | 7360 × 1870 × 1660 cm |
| Single Gross Weight | 4600.000 kg |
| Packaging Type | Vacuum package and plywood case |
Applications
- High-reliability SMT PCB assembly requiring void-free solder joints (BGA, QFN, LGA packages)
- Automotive ECU, power module, LED lighting, and EV battery management system PCB soldering
- Aerospace and defense electronics requiring MIL-spec solder joint integrity
- Medical device PCB assemblies where joint reliability is safety-critical
- Power electronics: IGBT modules, DC-DC converters, power supply assemblies
- Telecommunications and 5G infrastructure equipment PCB production
- Industrial automation control boards, relay modules, and sensor assemblies
- Consumer electronics, smart devices, and IoT hardware manufacturing
Industries Served
- Consumer electronics and smart device manufacturing
- Automotive electronics (ECUs, ADAS modules, LED lighting, EV battery systems)
- Aerospace & defense high-reliability PCB assemblies
- Medical devices and life sciences electronics
- Industrial automation, power electronics, and control systems
- Telecommunications, networking, and 5G infrastructure
- LED lighting and display panel production
| Weight | 4600 kg |
|---|---|
| Dimensions | 736 × 187 × 166 cm |
