Underfill Adhesive JC-3800 Series
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Underfill Adhesive JC-3800 Series is a one-component epoxy that fills the gap beneath CSP and BGA packages, protecting solder joints from thermal cycling and mechanical stress. Low viscosity and fast heat curing give good flow and reworkability. Part of our IBond range in Adhesives & Fluids.
Features:
– Effectively reduce the impact caused by the mismatch of the overall temperature expansion characteristics between the silicon chip and the substrate or external forces
– Cure quickly when heated, and its lower viscosity allows for better bottom filling, and its higher fluidity enhances its operability for rework
Applications:
– One-component epoxy sealants for CSP or BGA bottom fill processes
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