8-Zone Lead-Free Hot Air Reflow Oven JA-R8
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The 8-Zone Lead-Free Hot Air Reflow Oven JA-R8 has 16 independent heating zones with a patented air management structure for efficient convection and fast thermal compensation. PLC + PID control keeps profiles precise. Pairs well with our solder paste. Part of our Reflow Oven range.
Key Features
| Key Features | |
| 8+8 Zone Heating Architecture: | 16 independent heating zones (8 top / 8 bottom) with patented air management structure — delivers more efficient hot air convection and faster thermal compensation across the entire PCB. |
| PLC + PID Closed-Loop Control: | Dual-layer control via PLC and modular circuit with PID closed-loop temperature regulation, achieving industry-leading precision of ±1°C across all zones simultaneously. |
| Intelligent Diagnostic System (IDS): | Built-in IDS provides real-time trouble reminders, fault alerts, error list-out, and SPC data recording — minimizing downtime and enabling full process traceability. |
| Win7 Bilingual Interface: | Windows 7 platform with user-friendly GUI; easily swap between English and Chinese. Powerful software saves all settings, supports data printout and 80 GB process data storage. |
| Independent Zone & Blower Control: | Zone temperature and blower speed are controlled independently per zone — enabling precise profile management for diverse PCB types including BGA, CSP, and 0201 components. |
| Water Chiller Cooling System: | Forced-air cooling system with water chiller integration ensures rapid, stable thermal descent after the reflow peak — ideal for lead-free SAC alloy profiles. |
| Nitrogen Atmosphere Option: | Optional N2 module with O2 analyzer enables oxide-free soldering environment, dramatically reducing solder bridging and improving joint quality on fine-pitch and high-density boards. |
| Hardened Rail Track System: | Rail tracks treated with hardening process for superior wear resistance. Auto-lubrication as standard; optional SPG gear motor for automatic conveyor width adjustment. |
| Flux Removal Unit: | Integrated flux collection and removal unit meets environmental protection requirements and prevents flux contamination of heating elements for extended machine lifespan. |
| SMEMA / Inline Compatible: | Conveyor direction L→R (or R→L) with 900±20 mm standard SMT line height; mesh and chain conveyor system for reliable, smooth PCB transport across all board types. |
Product Description
The JA-R8 is a high-end, lead-free hot air reflow oven designed for demanding SMT production environments where precision, repeatability, and throughput are paramount. Featuring 16 independently controlled heating zones (8 top / 8 bottom) with a patented air management structure, the R8 delivers superior hot air convection and faster thermal compensation than conventional reflow systems.
Built on a Windows 7 platform with Siemens PLC and modular digital control, the R8 incorporates an Intelligent Diagnostic System (IDS) for real-time process monitoring, fault detection, and SPC data logging. Its optional nitrogen module makes it equally suitable for standard and oxide-sensitive high-reliability soldering applications — from consumer electronics to automotive, aerospace, and medical device PCB manufacturing.
Technical Specifications
| Specification | Details |
| HEATING SYSTEM | |
| Model | JA-R8 / JA-R8-N (Nitrogen variant) |
| Heating Zones | Top 8 / Bottom 8 (16 independent zones) |
| Cooling Zones | Top 3 / Bottom 3 |
| Heating Passage Length | 3,121 mm |
| Heating Style | Hot Air (forced convection) |
| Cooling Style | Water Chiller |
| Exhaust Volume | 10 m³/min × 2 exhaust ports |
| CONVEYOR SYSTEM | |
| Max. PCB Width | 420 mm (Alibaba spec) / 460 mm (R8-N spec) |
| Mesh Belt Width | 500 mm |
| Conveyor Direction | L → R (R → L optional) |
| Process Height | 900 ± 20 mm (standard SMT height) |
| Conveyor Type | Mesh and Chain |
| Conveyor Speed | 300 ~ 2,000 mm/min (adjustable) |
| Auto Lubrication | Standard |
| Fixed Track | Front Rail Fixed (optional: Rear Rail Fixed) |
| Product Clearance | Top and Bottom 25 mm |
| CONTROL SYSTEM | |
| Power Supply | 380V AC / 50~60Hz, 5-cable 3-phase |
| Total Power Consumption | ≤ 40 kW (Rated); ~1,000 W startup draw |
| Startup Consumption | 60 kW / 33 kW (peak) |
| Steady-State Consumption | 6 ~ 9 kW (during production) |
| Ramp-Up Time | ~20 minutes |
| Temp. Set-Point Range | Room temperature ~ 300°C |
| Temp. Control Method | PID Closed-Loop + SSR Driving |
| Temp. Control Precision | ±1°C |
| Data Storage | Process data and status (80 GB) |
| Nozzle Plate | Aluminum Alloy Plate |
| Alarm System | Abnormal Temp. (Over-temp / Low-temp); Board Drop Alarm |
| Signal Tower | Amber = Warning | Green = Normal | Red = Abnormal |
| OS / Interface | Windows 7; Chinese & English bilingual |
| GENERAL | |
| Machine Dimensions (L×W×H) | 5,300 × 1,350 × 1,550 mm (Alibaba listing) |
| Machine Dimensions R8-N | 5,620 × 1,445 × 1,520 mm (Made-in-China listing) |
| Machine Weight | ~2,200 kg |
| Color | Computer Grey |
| Nitrogen Option | Available (O2 Analyzer + N2 Pipes included) |
| Certification | CE, ISO 9000, CCC, RoHS |
| Warranty | 1 Year |
| Place of Origin | Shenzhen, Guangdong, China |
| * Specifications may vary between variants. Please confirm with JIT or your authorized distributor for the latest confirmed datasheet. | |
Applications
The JA-R8 is suited for high-precision, high-volume SMT reflow soldering processes including:
- High-volume SMT reflow soldering of lead-free (SAC305/SAC387) and tin-lead assemblies
- BGA, CSP, QFN, LGA, and fine-pitch component soldering requiring precise thermal profiles
- Mixed-technology PCB assembly (SMT + DIP) production lines
- Automotive ECU, ADAS sensor modules, and power electronics PCB manufacturing
- Medical device and aerospace PCB assemblies requiring strict process control and traceability
- Telecommunications, networking, and 5G infrastructure PCB production
- LED driver boards, power supplies, and industrial control PCBs
- High-reliability applications requiring nitrogen atmosphere (N2) soldering
Industries Served
- Consumer electronics and smart device high-volume manufacturing
- Automotive electronics (ECUs, ADAS, EV battery management, LED lighting systems)
- Aerospace & defense high-reliability PCB assemblies
- Medical devices and life sciences electronics
- Industrial automation, power electronics, and control systems
- Telecommunications, networking, and 5G infrastructure
- LED lighting and display panel production
Why Choose the R8?
| vs. Standard / Mid-Range Reflow Ovens | vs. Entry-Level 6-Zone Ovens |
| 16 independent heating zones (8T+8B) vs. 6–10 on mid-range machines — finer thermal profile control, superior zone-to-zone isolation, and faster thermal compensation for complex components. | Longer 3,121 mm heating passage and more zones means a gentler, better-controlled reflow profile — critical for lead-free SAC alloys, BGA, and high-density mixed SMT assemblies. |
| vs. Non-Nitrogen Reflow Ovens | vs. Batch / Offline Reflow |
| Optional N2 module reduces oxygen to <1,000 ppm — eliminates oxidation-related defects, improves solder joint brightness, and is essential for fine-pitch, flip-chip, and high-reliability assemblies. | Fully inline mesh-and-chain conveyor design enables continuous production flow with no board-to-board delays — seamlessly integrates into any SMT line at standard 900 mm height. |
