Description
JC-Q203 is a JIT ChemTech water-based cleaner for SMT production. It removes solder paste and flux from stencils, PCBA surfaces and post-soldering fixtures, with excellent wetting and penetration in ultrasonic and immersion cleaning — without corroding fixtures or whitening metal surfaces.
Key Features:
- Strong cleaning performance for solder paste and flux
- Excellent wetting and penetration
- Ultrasonic and immersion cleaning
- Suitable for lead-free processes
- Non-corrosive to fixtures and stencils
- No metal whitening after cleaning
- Halogen-free, ODS-free and RoHS compliant
Technical Specifications
| Item | Specification |
|---|---|
| Model | JC-Q203 |
| Appearance | Colorless, transparent liquid |
| pH | 12–14 |
| Specific gravity | 1.00–1.10 @ 25°C |
| Cleaning temperature | 40–50°C |
| Cleaning time | 5–20 min |
| Dilution | Up to 20× |
| Packaging | 25 kg / drum |
Composition
| Component / Chemical Name | Concentration (%) |
|---|---|
| Surfactant | 3–5% |
| Sodium Metasilicate Pentahydrate | 5–10% |
| Propylene Glycol Butyl Ether | 2–5% |
| Deionized Water | Balance |
Applications
- SMT stencil cleaning
- PCBA surface cleaning
- Removing solder paste and flux from post-soldering fixtures


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