Description
GOB LED Encapsulant JC-IBM-ER3010 is an IBond glue-on-board resin developed for the LED display field. It is applied over the LED surface of modules and screens to form a continuous, transparent protective layer that shields every LED chip from impact, moisture and dust, without changing the colour or brightness of the display.
Key Features:
- Full LED chip protection — a continuous encapsulation layer over the module surface
- Crystal-clear and color-neutral after curing
- Low shrinkage and heat-resistant for long-term stability
Applications
- LED modules
- Outdoor billboards
- Indoor LED screens
For technical data sheets, sampling or OEM formulation, contact our team — IBond offers 35–50% cost savings versus imported equivalents with rapid technical support.


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